DB视讯

English
中文 English 日本語 Deutsch Fran?ais Polski Espa?ol Portuguese

Select Region/language

DB视讯· (中国区)有限公司官网 Japan
日本語
DB视讯· (中国区)有限公司官网 Germany
Deutsch
DB视讯· (中国区)有限公司官网 France
Fran?ais
DB视讯· (中国区)有限公司官网 Poland
Polski
DB视讯· (中国区)有限公司官网 Latin America
Spanish
DB视讯· (中国区)有限公司官网 Brazil
Portuguese
DB视讯· (中国区)有限公司官网
0510 - 85958787
Mature production process
Massive production capacity guarantee
Contact us
  • Slice Thickness
    160um reduced to 130um
    (mass production)
  • Line Diameter
    40um reduced to 20um
    (mass production)
  • PV Wafer Size
    182.3x183.75,182.2x182.2,182.3x188,
    182.3x210,210x210
  • Process Time
    Shortened to 90 min
  • Leading in Industry
    Significant improvement in yield,
    output and decrease in cost
  • Industrial Union
    To advance the "large size and thin thickness" process of PV wafer
【网站地图】【sitemap】